Abstract: |
An embodiment of a semiconductor package apparatus may include technology to create a first participant enclave, verify a second participant enclave, approve a secure exchange of information between the first participant enclave and the second participant enclave, and exchange information between the first participant and the second participant enclaves if the exchange is approved. Other embodiments are disclosed and claimed. |
Inventor: |
Gumowski, Mariusz (Gdansk, PL) |
Applicant: |
Intel Corporation (Santa Clara, CA, US) |
Face Assignee: |
Intel Corporation (Santa Clara, CA, US) |
Filed: |
2017-09-25 |
Issued: |
2019-03-28 |
Claims: |
24 |
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US20190095910
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1. An electronic processing system, comprising:
(3)
(3)
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7. A semiconductor package apparatus, comprising:
(3)
(2)
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13. A method of securely exchanging information, comprising:
(3)
(4)
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19. At least one computer readable medium, comprising a set of instructions, which when executed by a computing device, cause the computing device to:
(3)
(4)
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